Literature: 		SPICE Newsletter
Description: 		Technical publication describing applications of the SPICE simulation program
Price:	 			FREE
Featured Topics:	New Magnetics Design Tool, Modeling Magnetics, New BSIM3 Model Implemented
Other Topics:		Modeling Mechatronics: A Synchro example
Contact:			Charles Hymowitz - Vice President intusoft (310) 833-0710, Fax (310) 833-9658
					E-mail: info@intusoft.com, http://www.intusoft.com


New Newsletter Discusses Magnetics Modeling

	The Intusoft Newsletter is a unique FREE publication dedicated to discussing topics related to the SPICE circuit simulation program.  The latest issue contains several application notes designed to help engineers simulate circuits more effectively.

	The first application note discusses a new methodology for producing Berkeley SPICE models of transformers or inductors. A general topology for a SPICE subcircuit of a magnetic device is detailed along with information on how the values for different elements can be calculated. Several example transformer models are provided as well as information on additional software utilities for transformer and inductor design.

	The second article discusses the new BSIM3 version 3 MOSFET model that has been implemented in the IsSpice4 analog simulation program. BSIM3v3 is the latest deep-submicron MOSFET model from the University of California at Berkeley. It is a physical model based on a coherent quasi two-dimensional analysis of the MOSFET device structure, taking into account the effects of device geometry and process parameters. In other words, dependencies of important geometry and process parameters such as channel length, channel width, gate oxide thickness, junction depth, substrate doping concentration, etc. are built into the model. BSIM3 allows users to accurately model MOSFET behavior over a wide range of existing technologies and predict the behavior for future technologies. The BSIM3v3 (version 3) model has been extensively modified from previous releases and is now the recommended version for IC simulation. The article includes sample simulations showing the DC, AC, and transient performance of the model.

	The last application note discusses how SPICE can be used to simulate mechatronics problems. These are designs in which mechanical, electrical, and other system oriented (mathematical) elements must interact with one another. SPICE modeling examples for a synchro and a resolver are provided.

	A floppy disk containing all of the schematics and SPICE models in the newsletter along with new Analog Devices IC models, new Teccor SCR models, new Powerex IGBT models and new digital IC models, is available for a nominal fee.

	The Intusoft Newsletter is the only regularly scheduled publication dedicated to SPICE modeling and analog circuit simulation.  An electronic version (Adobe Acrobat document) of the Intusoft Newsletter is posted on Intusoft's Web site (http://www.intusoft.com) and on CompuServe (CADD/CAM/CAE vendor forum). The peak newsletter circulation is 34,000 readers in over 110 countries.
